{"componentChunkName":"component---src-templates-blog-post-js","path":"/blog/samsung-electro-mechanics-develops-semiconductor-substrate-for-autonomous-vehicles/","result":{"data":{"site":{"siteMetadata":{"title":"No Frills News"}},"contentfulNfnPost":{"postTitle":"Samsung Electro-Mechanics Develops Semiconductor Substrate for Autonomous Vehicles","slug":"samsung-electro-mechanics-develops-semiconductor-substrate-for-autonomous-vehicles","createdLocal":"2023-02-27 14:31:01.758020","publishDate":"None","feedName":"Autonomous Vehicle News","sourceUrl":{"sourceUrl":"http://koreabizwire.com/samsung-electro-mechanics-develops-semiconductor-substrate-for-autonomous-vehicles/241549"},"postSummary":{"childMarkdownRemark":{"html":"<p>SEOUL, Feb. 27 (Korea Bizwire) — Samsung Electro-Mechanics Co., a major electronics parts maker in South Korea, said Sunday it had developed an advanced driver assistance systems (ADAS)-applicable flip chip ball grid array (FCBGA) and will expand its product lineup for automotive electronics.\nThe newly-developed FCBGA is a substrate for high-performance self-driving systems that is one of the products with the highest technological levels among those for automotive electronics.\nBy applying its microcircuit technology accumulated in the areas of high-end IT products such as servers for automotive electronics, Samsung Electro-Mechanics reduced circuit width and spacing by 20 percent compared to existing substrates for the stage of partial driving automation.\nAccordingly, more than 10,000 bumps were realized in a passport photo-sized space.\nIn addition, reliability was also addressed, including an improvement in flexural strength, to cope with multi-chip packages in which several chips are mounted on a single substrate at the same time.</p>"}}}},"pageContext":{"slug":"samsung-electro-mechanics-develops-semiconductor-substrate-for-autonomous-vehicles"}}}