Quantum computing moves from physics problem to manufacturing problem For years, the quantum computing race was told as a physics story: More qubits, higher fidelity, and so on. This framing was clear enough, but the real contest has now moved to the fab. The question is whether we can make thousands of qubits over and over again, with the same result, on a wafer or by other means, using a supply chain we actually control. This is, in many ways, a normal manufacturing story for a young technology, with a front-end, packaging, assembly and test, and it sits at the heart of Yole Group's knowledge, which will be detailed in the coming report, Quantum Technologies 2026. Every qubit has its own recipe Quantum is not like a standard complementary metal-oxide semiconductor (CMOS), and there is no single quantum process flow. Each way of building a qubit comes with its own machine, its own control chain, and its own headaches (see figure). Every modality has its own challenges. Superconducting qubits live or die by the Josephson junction, a tunnel barrier only a few atoms thick. It has long been made by double-angle shadow evaporation and lift-off, which is really more of a laboratory trick than a fab process. Junction uniformity sets how repeatable the qubit frequency is, and a spread of just a few percent can ruin a multi-qubit processor. In addition, two-level-system defects within the oxides and at the interfaces slowly drain coherence. Getting the process right here means ultraclean superconducting metals, meticulous attention to oxidation, and lift-off-free junction methods that can be replicated by industrial tools. Silicon spin qubits are the closest cousins to CMOS and already run on 300-mm lines at imec, CEA-Leti, and Intel. But close is not the same as CMOS. They need silicon enriched in