Intel teams up everywhere; GPU rowhammer attack; faster verification; Samsung’s new packaging site; Taiwan IC industry wants stockpiles; China poaches Taiwan talent; thinnest GaN chiplet; AFM-IR; Europe revenue drop; new edge design; BMW hydrogen power; Japanese automotive trouble. Intel will join Elon Musk’s Terafab chip manufacturing project alongside Tesla, SpaceX, and xAI. Intel described its role as helping refactor silicon fab technology for a project targeting production of 1 TW/year of compute for AI and robotics applications. Intel and Google are expanding a multi-year collaboration on AI and cloud infrastructure, with Intel Xeon processors continuing to power Google Cloud systems. Also, the two companies are expanding the co-development of custom ASIC-based IPUs. Broadcom will develop and supply Google with future TPUs, networking, and other components. Anthropic, Google, and Broadcom also inked a deal for multiple gigawatts of next-gen TPU capacity scheduled to come online in 2027, mostly located in the U.S. Taiwan’s Semiconductor Industry Association is asking the government to stockpile IC related raw materials like helium and liquified natural gas, and to support the reopening of nuclear power plants due to the ongoing conflict in the Middle East. South Korea’s big ambitions to “construct the highway for the AI era” could also be at risk due to the energy issues stemming from the Iran war, with startups being particularly vulnerable without the months’ worth of supplies some of the bigger chipmakers have. New tech Bruker is accelerating development of photothermal AFM-IR spectroscopy for semiconductor research, and has installed its Dimension IconIR system at imec under a joint development project focused on nanoscale materials and interface characterization. The company said the platform can deliver label-free chemical analysis with sub-5nm resolution. Intel Foundry demonstrated what it describes as the world’s thinnest GaN chiplet, built on a 300mm GaN-on-silicon wafer with a