New Taiwan adv. packaging site; M&A activity; GF’s CPO solution; Apple looks beyond TSMC; EU chip companies map; strong earnings; MIT’s new lidar chip; gallium production; AI inferencing at sea; quantum HW funding; PCIe 7 tool; home data centers; AI security warnings; temperature impact on EVs. ASE and WUS are jointly building a ~$1.1B advanced packaging hub in Kaohsiung, Taiwan, for fan-out chip-on-substrate (FOCoS) and flip-chip ball grid array (FC BGA) technologies. The new site is expected to be completed by September 2029. China is aiming to use 70% domestic chips by the end of this year, reports Nikkei Asia. Apple reportedly held early-stage talks with Intel and Samsung about producing main device processors in the U.S., as the company explores additional domestic manufacturing options beyond TSMC, according to Reuters. Discussions point to continued pressure on major chip customers to diversify advanced-node supply chains amid capacity, geopolitical, and U.S. manufacturing concerns. Siemens partnered with Xometry to develop an AI-native marketplace to bring together suppliers and buyers of custom manufacturing. Siemens also invested about $50M into Xometry, and noted it has invested $1B in U.S. manufacturing over the last 5 years. Nvidia and IREN inked a deal to deploy up to 5 GW of Nvidia’s DSX-aligned AI infrastructure across IREN’s Sweetwater, Texas campus, with NVIDIA receiving rights to invest up to $2.1B. Innovations Nvidia, PulteGroup, and Span are putting mini data centers in homes to take advantage of unused local grid electrical capacity. Panthalassa raised $140M to complete a pilot fab in Oregon and accelerate deployment of AI inferencing at sea using power generated from ocean waves. ST expects to generate more than $3B in cumulative space-related semiconductor revenue from 2026 through 2028, driven by demand for chips used in low-Earth orbit satellite networks. CEOs from ASML, Siemens, and five other