Amkor and Nvidia signed a $1.5B multiyear agreement to develop advanced packaging and test technologies for next-gen AI and accelerated-computing platforms. Nvidia’s prepayment will support Amkor’s U.S. capacity expansion in Arizona, including high-density interconnect and heterogeneous integration capabilities. Siemens announced plans to acquire two EDA companies: Defacto Technologies, a provider of tools for automated SoC design creation and integration, and Precision Innovations, which develops AI-driven chip planning and design exploration software built on the open-source OpenROAD framework. IBM plans to acquire HRL Laboratories, an R&D firm jointly owned by Boeing and GM with expertise in silicon-spin qubits and quantum sensing. Mitsubishi Electric and Sony Semiconductor will establish a joint venture, Advanced Vision Solutions, to develop image sensors with integrated AI-based analysis of visual data for a range of manufacturing equipment. Powertech Technology is planning a $400M joint venture with Broadcom to provide panel-level packaging services in Singapore, reports Taipei News. Anthropic plans to deploy up to 2 GW of AMD’s GPUs in the Helios racks, starting with 1GW in H1 2027. AMD will also invest up to $5B in Anthropic and use Claude for software development. Cerebras will combine AMD’s rack-scale solution with its wafer-scale engine in a single inference workflow. AMD partners deploying the new infrastructure include OpenAI, Meta, Microsoft, and others. Nokia is planning to acquire NXP‘s Chandler, Arizona fab to expand its indium phosphide semiconductor manufacturing capacity. Subject to approvals, Nokia plans to lease part of the site, starting early next year, and convert it to indium phosphide production for optical components, with the full acquisition expected to close in Q1 2029. Paras Semiconductors signed an MoU for a ~US$644M OSAT facility in Madhya Pradesh, India. Big funding Etched added $300M to scale production of its frontier model inference rack-scale system made up of co-designed chips, packages,