NEW TAIPEI CITY, Taiwan – Hon Hai Technology Group, more commonly known as Foxconn, on Thursday announced a strategic collaboration with Intel to jointly accelerate the development and deployment of next-generation artificial intelligence infrastructure and intelligent computing platforms. By combining Intel’s strengths in processor architecture, silicon technologies and software ecosystem with Foxconn’s global manufacturing scale, system integration expertise and AI data center deployment capabilities, the two companies will explore comprehensive AI solutions spanning silicon, rack, system and application layers, the company said. The collaboration also aims to accelerate the large-scale deployment of AI-driven technologies across edge and physical AI applications. “AI is rapidly transforming industries and society worldwide. Through our ‘3+3+3’ strategy, Foxconn continues to advance key technologies including AI, semiconductors and next-generation communications, while driving the development of our three core platforms: smart manufacturing, smart EV and smart city,” said Young Liu, Chairman and CEO of Hon Hai Technology Group. “Our collaboration with Intel will combine the strengths of both companies across computing platforms, system integration and global supply chain capabilities to jointly build next-generation AI infrastructure, edge AI and physical AI ecosystems, accelerating the adoption of AI applications worldwide,” he said. Under the collaboration framework, Intel and Foxconn will work together to scale AI-driven solutions by leveraging Intel’s computing platforms, silicon technologies and software ecosystem together with Foxconn’s system integration capabilities, manufacturing expertise and global customer reach. “The rapid growth of AI – especially in inference and agentic workloads at scale – is redefining what modern computing must deliver,” said Lip-Bau Tan, Intel CEO. “These demands require innovation across the full stack – from new silicon and chip design to rackscale systems and extending all the way to edge and physical AI deployments. Our collaboration with Foxconn brings together two innovation leaders with deep expertise in chip design,