The Dragonwing Q-2390 is designed to be feature rich, but also compact and affordable, said Qualcomm, which is pitching it at commercial, enterprise and consumer products – namely point-of-sale systems, kiosks, access control devices, smart appliances, smart agriculture, home robots, fitness equipment and enterprise terminals. Qualcomm says the new chip integrates application compute, on-device AI, and camera and display support, as well as LTE Cat 4, GPS, and various wired and wireless connectivity options. The second new Dragonwing is the IQ-2390, and is designed to bring greater intelligence to the industrial edge. Qualcomm says it combines application processing, machine vision, AI acceleration, and dual Gigabit Ethernet with Time-Sensitive Networking (TSN) – the IEEE standard that relates to mission-critical Ethernet connectivity. The IQ-2390 is also rugged by design, able to function across a greater temperature range – from -30°C to +115°C – and in environments that are susceptible to vibration and shock. Qualcomm said this makes it well suited to factories, power plants, and outdoor industrial environments, adding that it could support applications in the industrial automation, oil and gas, utilities, and energy sectors. "AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration," said Jeff Arnold, VP and general manager of auto telematics and industrial and embedded IoT consumer and connectivity at Qualcomm. "With the Dragonwing Q-2390 and IQ-2390 processors, we're enabling intelligence to scale across a much broader range of devices, from retail systems, smart appliances and consumer robots to industrial controllers, machine vision systems and critical infrastructure. Together, these platforms help bring advanced edge AI within reach of more customers and more industries than ever before." Drilling a bit deeper into the specs reveals many similarities. Their CPUs max out at 1.9